I-SMD & COB & GOB LED Ubani ozoba umkhuba wobuchwepheshe be-LED?

I-SMD & COB & GOB LED Ubani ozoba ubuchwepheshe obuholwa yisitayela?

Selokhu kwathuthukiswa Imboni Yokubonisa I-LED, izinqubo ezihlukahlukene zokukhiqiza nokupakisha zobuchwepheshe bokupakisha be-Small-pitch ziye zavela ngokulandelana.

Kusukela kubuchwepheshe bokupakisha obudlule be-DIP kuya kubuchwepheshe bokupakisha be-SMD, kuye ekuveleni kobuchwepheshe bokupakisha be-COB, futhi ekugcineni kuze kube ukuvelaUbuchwepheshe be-GOB.

 

I-SMD Packaging Technology

https://www.avoeleddisplay.com/rental-led-display-r-series-product/
Ubuchwepheshe bokuboniswa kwe-SMD LED

 https://www.avoeleddisplay.com/gob-led-display-product/

I-SMD isifinyezo se-Surface Mounted Devices.Imikhiqizo ye-LED ehlanganiswe yi-SMD (ubuchwepheshe bokukhweza okungaphezulu) ihlanganisa izinkomishi zezibani, abakaki, ama-wafers, ama-lead, i-epoxy resin, nezinye izinto ezisetshenziswayo zibe ubuhlalu besibani bezinto ezahlukene.Sebenzisa umshini wokubeka onesivinini esikhulu ukuze udayise ubuhlalu besibani ebhodini lesifunda nge-high-temperature reflow soldering ukuze wenze amayunithi wokubonisa anezikhala ezihlukene.

Ubuchwepheshe be-SMD LED

Isikhala esincane se-SMD ngokuvamile sidalula ubuhlalu besibani se-LED noma sisebenzisa imaski.Ngenxa yobuchwepheshe obuvuthiwe nobuzinzile, izindleko eziphansi zokukhiqiza, ukushabalaliswa kokushisa okuhle, kanye nokugcinwa okulungile, kuphinde kube nesabelo esikhulu emakethe yezicelo ze-LED.

Isibonisi esikhulu se-SMD LED sisetshenziselwa ibhodi lokukhangisa le-LED elingaguquki langaphandle.

I-COB Packaging Technology

I-COB LED
Isibonisi se-COB LED

 Isibonisi se-COB se-LED

Igama eligcwele lobuchwepheshe bokupakisha be-COB yi-Chips on Board, okuwubuchwepheshe bokuxazulula inkinga yokukhishwa kokushisa kwe-LED.Uma iqhathaniswa ne-in-line ne-SMD, ibonakala ngokonga isikhala, ukwenza imisebenzi yokupakisha ibe lula, nokuba nezindlela zokuphatha ezishisayo.

Ubuchwepheshe be-COB LED

I-chip engenalutho inamathela ku-interconnect substrate ene-conductive noma non-conductive glue, bese i-wire bonding yenziwa ukuze kubonakale ukuxhumana kwayo kukagesi.Uma i-chip engenalutho ibonakala ngokuqondile emoyeni, iyakwazi ukungcoliswa noma ukulimala komuntu, okuthinta noma okucekela phansi umsebenzi we-chip, ngakho-ke i-chip nezintambo zokubopha zihlanganiswe neglue.Abantu baphinde babize lolu hlobo lwe-encapsulation ngokuthi i-encapsulation ethambile.Inezinzuzo ezithile mayelana nokusebenza kahle kokukhiqiza, ukumelana nokushisa okuphansi, ikhwalithi yokukhanya, isicelo, kanye nezindleko.

I-SMD-VS-COB-LED-Display

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I-COB LED eyinhloko yesibonisi esetshenziswa ekuphakameni kwangaphakathi nencane Nge-Energy LED Screen Display.

Inqubo ye-GOB Technology
Isibonisi se-GOB LED

https://www.avoeleddisplay.com/gob-led-display-product/ 

Njengoba sonke sazi, ubuchwepheshe obuthathu bokupakisha obukhulu be-DIP, i-SMD, ne-COB kuze kube manje buhlobene nobuchwepheshe bezinga le-chip ye-LED, futhi i-GOB ayibandakanyi ukuvikelwa kwama-chips e-LED, kodwa kumojula yokubonisa ye-SMD, idivayisi ye-SMD. Kuwuhlobo lobuchwepheshe bokuvikela ukuthi unyawo lwe-PIN lwabakaki lugcwaliswe ngeglue.

I-GOB isifinyezo se-Glue ebhodini.Kuwubuchwepheshe bokuxazulula inkinga yokuvikelwa kwesibani se-LED.Isebenzisa into entsha esobala ethuthukisiwe ukupakisha i-substrate kanye neyunithi yayo yokupakisha ye-LED ukwenza isivikelo esisebenzayo.Izinto ezibonakalayo azigcini nje ngokuba nokucaca okuphezulu kakhulu kodwa futhi zinokusebenza okuphezulu kwe-thermal.Iphimbo elincane le-GOB lingakwazi ukuzivumelanisa nanoma iyiphi indawo ezungezile enokhahlo, liqaphela izici zokuqina kwangempela komswakama, ukungenwa kwamanzi, ukuvikela uthuli, ukungqubuzana, kanye ne-anti-UV.

 

Uma kuqhathaniswa nesibonisi se-LED se-SMD esivamile, izici zayo ziwukuvikela okuphezulu, ukumelana nomswakama, ukungangeni kwamanzi, ukulwa nokushayisana, i-anti-UV, futhi ingasetshenziswa ezindaweni ezinokhahlo ukugwema amalambu afile endaweni enkulu kanye nezibani zokulahla.

Uma kuqhathaniswa ne-COB, izici zayo ziwukugcinwa okulula, izindleko eziphansi zokulungisa, i-engeli enkulu yokubuka, i-engeli yokubuka evundlile, kanye ne-engeli yokubuka eqondile ingafinyelela kuma-degree angu-180, okungaxazulula inkinga yokungakwazi kwe-COB ukuxuba izibani, i-modularization ejulile, ukuhlukaniswa kombala, ukungafihli kahle kwendawo, njll. inkinga.

I-GOB eyinhloko isetshenziswe Esikrinini Sokukhangisa Sedijithali Sangaphakathi Se-LED.

Izinyathelo zokukhiqiza zochungechunge lwe-GOB imikhiqizo emisha zihlukaniswe ngezinyathelo ezi-3:

 

1. Khetha izinto ezisetshenziswayo zekhwalithi engcono kakhulu, ubuhlalu besibani, izixazululo ze-IC zebhrashi eziphakeme kakhulu, nama-chips e-LED ekhwalithi ephezulu.

 

2. Ngemuva kokuthi umkhiqizo uqoqwe, uguga amahora angu-72 ngaphambi kwe-GOB potting, futhi isibani siyahlolwa.

 

3. Ngemva kwe-GOB potting, ukuguga amanye amahora angu-24 ukuze uqinisekise kabusha ikhwalithi yomkhiqizo.

 

Emqhudelwaneni wobuchwepheshe bokupakisha be-LED be-pitch encane, ukupakisha kwe-SMD, ubuchwepheshe bokupakisha be-COB, nobuchwepheshe be-GOB.Mayelana nokuthi ubani kwabathathu ongawina umncintiswano, kuncike kubuchwepheshe obuthuthukisiwe nokwamukelwa kwemakethe.Ubani ophumelele ekugcineni, ake silinde sibone.


Isikhathi sokuthumela: Nov-23-2021